• 4-chamber single wafer horizontal electroplating process equipment

    PRODUCTS AND SERVICES > Semiconductor Equipment Series > 4-chamber single wafer horizontal electroplating process equipment

    4-chamber single wafer horizontal electroplating process equipment

      Functional application  

    ·RDL、、、、Bumping、、、、TSV.

    ·Uniformity within the tablet: < 4%

    ·Inter-slice uniformity: < 3%

    ·Repeatability: < 3%

    ·COP: < 10µm




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